Integrated Surface Stimulation Device for Wound Therapy and Infection Control

摘要

The present invention provides a thin and flexible device and method of use thereof for wound treatment and infection control. The integrated surface stimulation device may comprise a complete wireless stimulation system in a disposable and/or reusable flexible device for widespread use in multiple therapeutic applications. The invention would be situated on the skin surface of a patient and would be activated so as to reduce the overall occurrence of infections and/or increase wound healing rates. As provided, the device will comprise an integrated power supply and pre-programmable stimulator/control system on a flexible polymeric substrate layer with areas of stimulating electrodes, applied using techniques such as those found in additive manufacturing processes. The device is especially valuable in treating biofilm-based infections.

主权项

1. A method for making electrode patterns in flexible substrates for use with an Integrated Surface Stimulation Device (ISSD) for wound therapy and infection control, the method comprising:
defining dimensions of a flexible substrate layer using at least one STL (STereoLithography) file; defining topographical areas of electrically conductive materials and electrically non-conductive materials using said at least one STL (STereoLithography) file; forming, through additive manufacturing techniques, a flexible substrate layer having said dimensions, formed from the group comprising polyimides, liquid crystal polymers, silicones, fabrics, and thermoplastic polymers; and forming areas of electrically conductive material and areas of electrically non-conductive materials based upon said defining of topographical areas of electrically conductive materials and electrically non-conductive materials, wherein: said step of forming areas of electrically conductive material and areas of electrically non-conductive materials utilizing said additive manufacturing techniques and executing concurrently with said forming of said flexible substrate layer.