| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat transfer assembly for controlling the temperature of a substrate supporting body such as an electrostatic chuck as well as the temperature uniformity of the substrate to enhance the processing and minimize undesirable yield losses in a semiconductor substrate processing. <P>SOLUTION: The heat transfer assembly 164 having a heat spreading plate 254 is sandwiched between a heat source of an embedded heater 132 and a heat sink 166. The heat sink 166, the heat spreading member, and the heat source of the embedded heater 132 are pressed against the bottom of a substrate supporting plate 116 by a bias member 190. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
