| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable improving the reliability of the connection of a thin metallic wire, when the size of a second semiconductor chip is sufficiently larger than that of a first semiconductor chip. <P>SOLUTION: A first semiconductor chip 1 and a second semiconductor chip 2 being larger than the first semiconductor chip 1 are mounted on a wiring substrate 20, the rear surface of the first semiconductor chip 1 and the rear surface of the second semiconductor chip 2 are adhered with an adhesive 14, and the sides of the adhesive 14 are inclined to a part of the second semiconductor chip 2, protruding from the first semiconductor chip 1, and have a concave shape. This can suppress the occurrence of micro-cracks in the second semiconductor chip 2 due to the impact of a thin metallic wire 7 for connecting the second semiconductor chip 2 to the wiring substrate 20, and the occurrence of defective bonding of the thin metallic wire 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
