发明名称 |
JOINED ARTICLE AND MEMBER FOR HOLDING WAFER AND STRUCTURE FOR MOUNTING THE SAME, AND METHOD FOR TREATING WAFER |
摘要 |
<p>A joined article, which comprises a plate-shaped ceramic article (3), a ring-shaped member (9) and a cylindrical metal member (7) having one end being joined to the under surface of the above plate-shaped ceramic article (3) via a metal joint (5) and another end being joined to the above ring-shaped member (9), wherein the above cylindrical metal member (7) relieves the stress owing to the difference in the thermal expansion coefficient between the plate-shaped ceramic article (3) and the ring-shaped member (9).</p> |
申请公布号 |
WO2006090730(A1) |
申请公布日期 |
2006.08.31 |
申请号 |
WO2006JP303150 |
申请日期 |
2006.02.22 |
申请人 |
KYOCERA CORPORATION;NAKAMURA, TSUNEHIKO;MAEHARA, TATSUYA |
发明人 |
NAKAMURA, TSUNEHIKO;MAEHARA, TATSUYA |
分类号 |
H01L21/683;H01L21/3065;H01L21/31 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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