发明名称 Subträgerbaugruppe und Verfahren zu dessen Verpackung
摘要 A submount assembly (10) comprising: a submount (18) having opposed first and second surfaces (18a, 18b), wherein the first surface (18a) of said submount (18) defines a first groove (54) opening through the first surface (18a) and having a pair of opposed sidewalls (54b); a laser diode (12) mounted upon a sidewall (54b) of the first groove (54) defined by the first surface (18a) of the submount (18) such that an output of the laser diode (12) is directed toward the opening of the first groove (54) through the first surface (18a) of the submount (18); and an active gain medium (14) supported by the first surface (18a) of the submount (18) so as to overlie at least that portion of the first groove (54) within which the laser diode (12) is disposed such that the output of the laser diode (12) pumps the active gain medium (14). <IMAGE>
申请公布号 DE69931530(T2) 申请公布日期 2006.12.21
申请号 DE1999631530T 申请日期 1999.02.24
申请人 LITTON SYSTEMS INC. 发明人 PETERSON, BRIAN LEE
分类号 H01L21/52;H01S3/02;H01S3/06;H01S3/0941;H01S5/00;H01S5/022;H01S5/024;H01S5/04 主分类号 H01L21/52
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