| 摘要 |
PROBLEM TO BE SOLVED: To improve workability in mounting a semiconductor cooling unit.SOLUTION: A vehicle power conversion device 3 is provided which comprises a unit body 30 and a box body 10. The unit body 30 comprises a heating section 32 including a power conversion circuit 31, a heat dissipation mechanism 33 for cooling the heating section through heat dissipation, and a first connector section 45 conducted to the power conversion circuit 31. The box body 10 comprises a second connector section 16 connected to the first connector section, and supports the unit body in a freely removable state in the state where the heat dissipation mechanism is exposed outside while accommodating the heating section inside. The box body includes a box body side engagement part 25 provided on a mounting surface 10b of the box body where an opening part 12 is formed for accommodating the heating section inside, and exposed outside of the box body. The unit body includes a unit side engagement part 48 which can be engaged to and disengaged from the box body side engagement part. While maintaining the state of engaging the box body side engagement part and the unit side engagement part, the first connector section and the second connector section can be connected and disconnected. |
