| 摘要 |
A microelectronic package includes a substrate ( 110 ), a die ( 120 ) electrically connected to the substrate, and a heat dissipation device ( 130 ) coupled to the die. The heat dissipation device includes a capacitor ( 250, 310 ). In one embodiment the heat dissipation device is a microchannel having a base ( 131 ) and a cover plate ( 132, 300 ) over the base, and the capacitor is located within the cover plate. |
