发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method and laser beam machining apparatus that can prevent expansion of a heat-affected layer caused by excessive heat input and generation of micro crack due to supercooling, by optimizing a light intensity distribution profile in the irradiation face. <P>SOLUTION: The laser beam machining apparatus is composed of a laser oscillator 10 for outputting a nearly parallel laser beams LB, a converging optical system 30 having a converging power in the X direction, a converging optical system 40 having a converging power in the Y direction, and the like. The laser beams LB passed through the converging optical system 40 is provided with an elliptical beam shape PB having a major axis in the relative moving direction (Y direction), in the irradiation position B of a workpiece 50, wherein the light intensity distribution YB along the major axis is asymmetric. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008093706(A) 申请公布日期 2008.04.24
申请号 JP20060278774 申请日期 2006.10.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 SEGUCHI MASAKI;OKAMOTO TATSUKI;SONO ATSUHIRO;KONO HIROYUKI
分类号 B23K26/073;B23K26/06;B23K101/40 主分类号 B23K26/073
代理机构 代理人
主权项
地址