发明名称 COPPER-BASED DEPOSITED ALLOY BOARD FOR CONTACT MATERIAL AND PROCESS FOR PRODUCING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a copper-based deposited alloy board for contact material capable of improving the operability of a multifunctional switch used for electronic equipment or the like. <P>SOLUTION: A copper-based deposited alloy board for contact material having differences between three tensile strengths, namely, the tensile strength along the rolling direction, the tensile strength along the direction sloping with an angle of 45°C from the rolling direction and the tensile strength along the direction sloping with an angle of 90°C from the rolling direction, the maximum of the differences being 100 MPa or less. The copper-based deposited alloy board comprises, by mass, 2 to 4% Ni and 0.4 to 1% Si, and, if required, further comprises at least one selected from the group consisting of Mg, Sn, Zn and Cr by suitable quantity, and the balance copper with inevitable impurities. Further, the copper-based deposited alloy board for contact material, can be produced by applying aging heat treatment to a copper alloy board which has been solution heat-treated, and then applying cold rolling thereto at a draft of≤30%. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008095186(A) 申请公布日期 2008.04.24
申请号 JP20070237213 申请日期 2007.09.12
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 MIHARA KUNITERU;ONO MASAHITO;TOKUHARA NAOFUMI;EGUCHI TATSUHIKO
分类号 C22C9/06;C22C9/00;C22F1/00;C22F1/08;H01B1/02;H01B13/00 主分类号 C22C9/06
代理机构 代理人
主权项
地址