发明名称 OPTICAL CHARACTERIZATION OF PHOTONIC INTEGRATED CIRCUITS
摘要 In one aspect, the present invention provides techniques and apparatus for optical characterization of photonic devices and/or circuits. By way of example, the techniques can be used to identify damaged devices in photonic integrated circuits. In some embodiments, thermal imaging is employed as a diagnositic tool for characterizing the devices/ciccuits under investigation. For example, in one embodiment, integrated cascaded semiconductor amplifiers can be characterized using amplied spontaneous emission from one amplifier as a thermal modulation input to another amplifier. A thermoreflectance image of the second amplifier can reveal flaws, if present. Further, in some embodiments, thermal imaging in conjunction with a total energy model can be employed to charaterize the elements of photonic circuits optically and/or to map the optical power distribution throughout the circuits.
申请公布号 WO2008137848(A3) 申请公布日期 2009.03.05
申请号 WO2008US62660 申请日期 2008.05.05
申请人 MASSCHUSETTS INSTITUTE OF TECHNOLOGY (MIT);HOLYOKE, MOUNT;HUDGINGS, JANICE, A.;FARZANEH, MARYAM;RAM, RAJEEV, J. 发明人 HUDGINGS, JANICE, A.;FARZANEH, MARYAM;RAM, RAJEEV, J.
分类号 G01K11/12;G01N25/72 主分类号 G01K11/12
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