SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

摘要

Systems and methods for forming MEMS assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (MEMS) assembly includes providing a first MEMS wafer including a metal layer on an inner surface and one or more cavities for forming a MEMS component, attaching a MEMS capping wafer, having at least one through hole via, to the inner surface of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via.

主权项

1. A method for manufacturing a wafer of a microelectromechanical systems (MEMS) assembly, the method comprising:
providing the wafer comprising a buried oxide layer; depositing and patterning a first photo resist layer on the wafer; performing reactive ion etching on a surface of the wafer, the ion etching extending to the buried oxide layer; removing the first photo resist layer; removing portions of the buried oxide layer, thereby forming one or more cavities within the wafer; depositing a first metal layer configured to act as a getter within the one or more cavities; and depositing a second metal layer on the first metal layer.