发明名称 NICKEL PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide nickel columns having uniform height and a nickel under bump metal having a smooth surface which are useful in semiconductor assembly techniques.SOLUTION: Electroplating is performed with a nickel plating solution; which contains nickel ions, sulfamic acid ions, and a compound selected from C1-4 alkanesulfonic acids and C2-4 alkenesulfonic acids.SELECTED DRAWING: Figure 1
申请公布号 JP2016121377(A) 申请公布日期 2016.07.07
申请号 JP20140261330 申请日期 2014.12.24
申请人 ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD;ROHM & HAAS DENSHI ZAIRYO KK 发明人 YUN JU MI;LEE IL SEOK;IMANARI MASAAKI
分类号 C25D3/12;C25D5/02;C25D5/12;C25D7/12;H01L21/60 主分类号 C25D3/12
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