发明名称 |
NICKEL PLATING SOLUTION |
摘要 |
PROBLEM TO BE SOLVED: To provide nickel columns having uniform height and a nickel under bump metal having a smooth surface which are useful in semiconductor assembly techniques.SOLUTION: Electroplating is performed with a nickel plating solution; which contains nickel ions, sulfamic acid ions, and a compound selected from C1-4 alkanesulfonic acids and C2-4 alkenesulfonic acids.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016121377(A) |
申请公布日期 |
2016.07.07 |
申请号 |
JP20140261330 |
申请日期 |
2014.12.24 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS KOREA LTD;ROHM & HAAS DENSHI ZAIRYO KK |
发明人 |
YUN JU MI;LEE IL SEOK;IMANARI MASAAKI |
分类号 |
C25D3/12;C25D5/02;C25D5/12;C25D7/12;H01L21/60 |
主分类号 |
C25D3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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