COMPOSITION FOR FORMING COPPER FILM FOR LASER PROCESSING, MANUFACTURING METHOD OF WIRING BOARD, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide: a composition for forming a copper film for laser processing, capable of highly precisely forming a low-resistance copper wiring board at low energy by patterning using laser processing; a manufacturing method of a wiring board, using the composition for forming a copper film for laser processing; and an electronic apparatus including a wiring board obtained by the manufacturing method of a wiring board.SOLUTION: A composition for forming a copper film for laser processing is prepared, the composition containing a copper salt (A) and a solvent (B). A manufacturing method of a wiring board includes: a step (1) of coating the composition for forming a copper film for laser processing on a substrate to form a coat; a step (2) of heating the coat to form a copper film; and a step (3) of laser-processing the copper film to form a copper wiring. An electronic apparatus includes a wiring board manufactured by the manufacturing method of a wiring board.SELECTED DRAWING: None