| 摘要 |
PROBLEM TO BE SOLVED: To excellently clean one principal plane by supplying the one principal plane of a substrate held by the substrate holding part facing a substrate holding part with an ultrasonic wave application liquid having sufficient energy.SOLUTION: The substrate cleaning method for cleaning one principal plane of a substrate held by a substrate holding part provided by facing the one principal plane of the substrate includes: an ultrasonic wave application liquid supply step of generating an ultrasonic wave application liquid by applying an ultrasonic wave to a deaerated liquid, which is a deaerated liquid, at an ultrasonic wave application position on the opposite side of the substrate with respect to the substrate holding part and supplying the ultrasonic wave application liquid toward one principal plane; and a cleaning step of cleaning the one principal plane with the ultrasonic wave application liquid after increasing dissolved gas concentration of the ultrasonic wave application liquid at a position closer to the one principal plane than the ultrasonic wave application position.SELECTED DRAWING: Figure 5 |
