| 摘要 |
PROBLEM TO BE SOLVED: To provide a light irradiation module that can reduce the heat resistance of a substrate and can adopt a relatively compact cooling mechanism.SOLUTION: A light irradiation module includes a substrate, a plurality of LED chips which are mounted on a surface of the substrate and emit ultraviolet light in a direction orthogonal to the surface of the substrate, and a heat radiation member which is disposed in close contact with the back surface of the substrate and radiates heat occurring in the LED chips to the outside. The substrate has a plate-like metal base which have the plurality of LED chips mounted on the surface thereof, electrically connected to first electrodes formed on the back surfaces of the LED chips, and supplies power to the first electrodes, and an insulating portion provided in close contact with the back surface side of the metal base. On the metal base is arranged a wiring substrate which is electrically connected to a second electrode formed on the surface of each LED chip and supplies power to the second electrode. The thickness of the metal base ranges from 1.0 to 2.0 mm, and the thickness of the insulating portion is configured to be thinner than the thickness of the metal base.SELECTED DRAWING: Figure 1 |
