| 摘要 |
PURPOSE: To obtain a semiconductor chip by cutting a substrate efficiently. CONSTITUTION: A nitride-based crystal is successively grown on such a substrate as sapphire by MOCVD or the like, and further a p electrode and an n electrode are formed. By cutting a wafer 1 along two directions forming 120° each other instead of cutting along two orthogonal directions, a diamond-like semiconductor chip is obtained. Since the semiconductor chip has six-fold rotary symmetry within one surface of the wafer. Therefore, by cutting the semiconductor chip at an angle of 120°, cutting directions become equivalent one another for cutting in a direction for achieving easy cutting.
|
