Semiconductor Integrated Circuit Device Electrically Connecting Integrated Circuit Modules Stacked Sequentially With 3-Dimensional Serial And Parallel Circuits And Method Of Forming The Same

摘要

A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.