发明名称 JOINT STRUCTURE FOR ELECTRONIC COMPONENT, CASE FOR ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which secures good adhesive force even when areas of a joint surface between a case and a substrate and a joint surface between a lid of the case and a frame plate etc. are reduced, and to provide a joint structure and a case used in the electronic component.SOLUTION: An electronic component 10A has a joint structure for an electronic component. The joint structure for the electronic component has: a first member 13; a second member 11 which should be joined to the first member 13; and a joint material 15 disposed between the first member 13 and the second member 11. The first member 13 has a through hole 17 opening on a joint surface joined to the second member 11. The joint material 15 fills the through hole 17.SELECTED DRAWING: Figure 1
申请公布号 JP2016139717(A) 申请公布日期 2016.08.04
申请号 JP20150014128 申请日期 2015.01.28
申请人 KYOCERA CHEMICAL CORP 发明人 AOKI HISAO;HARA TAKASHI
分类号 H01L23/02;H04R1/02 主分类号 H01L23/02
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