发明名称 BASE MATERIAL FILM FOR PRINTABLE ELECTRONICS AND METHOD FOR MANUFACTURING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a base material film for printable electronics, when used as a base material of a circuit board (wiring circuit board) manufactured by a printing method, having excellent adhesion and conductivity to the base material and further capable of forming a wiring circuit (conductive pattern), which is formed in fine thin lines and integrated, with a simple process.SOLUTION: The base material film for printable electronics is a film having a primer coat layer on at least one surface of a plastic film, and has absorption peaks at around 761 cmand around 1,675 cm, respectively, in an ATR-IR spectrum on a surface of the primer coat layer.
申请公布号 JP2014135364(A) 申请公布日期 2014.07.24
申请号 JP20130002021 申请日期 2013.01.09
申请人 DAICEL CORP 发明人 YOKOYAMA AYA;OKAMOTO KAZUKI;ITO DAISUKE;ITO HISAYOSHI
分类号 H05K3/18;B32B7/02 主分类号 H05K3/18
代理机构 代理人
主权项
地址