| 摘要 |
PROBLEM TO BE SOLVED: To reduce damages on an adhesive resin layer at the time of manufacturing a semiconductor wafer processing sheet including the adhesive resin layer and at the time of attachment to a wafer.SOLUTION: A semiconductor wafer processing sheet according to the present embodiment comprises an adhesive resin layer which is laminated in a peelable manner on an adhesive layer of a nearly circular pressure sensitive adhesive sheet having a base material and the adhesive layer provided on one surface of the base material, in which a planar shape of the adhesive resin layer is polygonal. |
