| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of suppressing that a sensor chip is damaged, and to provide a support device therefor.SOLUTION: A lead frame 11 including a supporting part 12 and a lead part 10 is prepared (a preparation step). To the supporting part 12, a thermosetting resin layer 61 of a pedestal 60 configured by the thermosetting resin layer 61, an elastic body layer 62, and a temporary adhesion layer 63 having an adhesive force lower than that of the thermosetting resin layer 61, is attached. Next, a sensor chip 20 is attached and fixed to the temporary adhesion layer 63 of the pedestal 60 (a fixation step). In addition, the lead part 10 and the sensor chip 20 are electrically connected (an electrical connection step). Then, sealing with a mold resin 30 is performed so that one end 23 side and a sensing part 25 of the sensor chip 20, and a part of the lead part 10 are exposed (a sealing step). Thereafter, the temporary adhesion layer 63 is peeled off from the sensor chip 20 (a removal step). |
