| 摘要 |
A substrate liquid processing method is provided with, after a step of forming a liquid film of a first processing liquid (DIW) on a surface of a substrate, a substitution step of substituting the first processing liquid, present on the surface of the substrate including the inside of a recess (R), with a second processing liquid (IPA). According to an embodiment, the substitution step includes: a liquid film formation stage in which the second processing liquid is supplied to the surface of the substrate covered with the liquid film of the first processing liquid while the substrate is rotated at a first rotational speed, and in which, on the substrate surface, a liquid film of the second processing liquid including the first processing liquid is formed; and, thereafter, a substitution promotion stage for promoting the substitution with the second processing liquid in which the second processing liquid is supplied with the rotational speed of the substrate being decreased to a second rotational speed lower than the first rotational speed, and in which the point of landing of the second processing liquid on the surface of the substrate is moved between a center portion and a peripheral portion of the substrate. |
