ELECTRONIC MODULE, AND ELECTRONIC APPARATUS USING THE ELECTRONIC MODULE

摘要

PROBLEM TO BE SOLVED: To mitigate the temperature rise of the ceiling plane of a housing of an electronic apparatus due to the heat generated from an electronic component for generating the largest amount of heat.SOLUTION: An electronic module 100 includes a module substrate 1 provided with predetermined wiring, a plurality of electronic components 5-10 mounted on the module substrate 1 while being distributed, and a connection electrode 4 formed on the back surface of the module substrate 1. Out of the plurality of electronic components 5-10, the electronic component 9 for generating the largest amount of heat per unit time during use is mounted on the back surface of the module substrate 1. The electronic component 9 mounted on the back surface of the module substrate 1 is coated with a mold resin 11. The electronic components 5-8 mounted on the front surface of the module substrate 1 are not coated with the mold resin.