| 摘要 |
PROBLEM TO BE SOLVED: To obtain extremely high polishing accuracy by press-contacting the surface 11 to be polished of a wafer 10 with the polishing surface 16 of a turntable 15 in parallel with the surface 16 with a more uniform force through a carrier plate 20. SOLUTION: A wafer polishing device is provided with an elastic ring 35 which is fitted to the lower surface 31 of a top ring 30 and, when the carrier plate 20 is pressed by means of the top ring 30, is press-contacted with the outer peripheral edge of the upper surface 24 of a the carrier plate 20 or its vicinity and demarcates a pressure chamber 38 between the lower surface 31 of the top ring 30 and the upper surface 24 of the carrier plate 20, a pressurizing device 40 which pressurizes the pressure chamber 38 by supplying a pressure gas to the chamber 38, and a pressure adjusting device 42 which adjusts the pressure in the chamber 38 produced by means of the pressurizing device 40. |
