DEVICE FOR SPRAYING A PLATING SOLUTION ON LEAD FRAME WITHOUT ACCOMPANYING VORTEX

摘要

PURPOSE: A device for spraying a plating solution on a lead frame is provided to increase flux and flow rate of the plating solution sprayed from the nozzle by removing vortex generated near an entrance of nozzle and preventing width of plating solution channel being narrowed. CONSTITUTION: In a device in which plating solutions are supplied to distribution part(30) so that the plating solutions are evenly mixed with each other, and the plating solution is sprayed onto lead frame through nozzle(40) mounted on an upper part of the distribution part, the device is characterized in that an expanded pipe(50) is installed in a divergent pipe shape at a lower part of the nozzle so that an entrance of the expanded pipe whose inner diameter is larger than inner diameter of the nozzle is gradually decreased to size of the inner diameter of the nozzle, wherein the expanded pipe on the lower part of the nozzle is insertingly mounted on the inner side of the distribution part, and wherein the expanded pipe on the lower part of the nozzle is projectingly mounted on the outer side of the distribution part.