发明名称 |
DOUBLE-SIDED TYPE AND MULTILAYER TYPE OPTICAL BACKPLANE SUBSTRATE AND FABRICATING METHOD THEREOF, IN WHICH HIGH SPEED AND LARGE VOLUME DATA IS CONNECTED OPTICALLY |
摘要 |
PURPOSE: A double-sided type and a multilayer type optical backplane substrate and a fabricating method thereof are provided to transmit and receive optical signals of high capacity by forming the optical backplane substrate with a both-sided structure or a multilayer structure. CONSTITUTION: A plurality of clad layers(402a,402b) are formed on both sides of a substrate. A plurality of core layers(403a,403b) are patterned on each side of the clad layers. A plurality of over-clad layers(404a,404b) are formed on each side of the core layers. A plurality of metal layers are formed on each side of the over-clad layers. A waveguide is formed by laminating the clad layers, the patterned core layers, and the over-clad layers on the substrate. The clad layers, the patterned core layers, the over-clad layers are repeatedly formed on the waveguide.
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申请公布号 |
KR20040081838(A) |
申请公布日期 |
2004.09.23 |
申请号 |
KR20030016387 |
申请日期 |
2003.03.17 |
申请人 |
LG ELECTRONICS INC. |
发明人 |
LEE, GI DONG;LEE, JAE EUN;LEE, SEONG EUN;YOON, SANG SU |
分类号 |
G02B6/12;(IPC1-7):G02B6/12 |
主分类号 |
G02B6/12 |
代理机构 |
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