发明名称 DOUBLE-SIDED TYPE AND MULTILAYER TYPE OPTICAL BACKPLANE SUBSTRATE AND FABRICATING METHOD THEREOF, IN WHICH HIGH SPEED AND LARGE VOLUME DATA IS CONNECTED OPTICALLY
摘要 PURPOSE: A double-sided type and a multilayer type optical backplane substrate and a fabricating method thereof are provided to transmit and receive optical signals of high capacity by forming the optical backplane substrate with a both-sided structure or a multilayer structure. CONSTITUTION: A plurality of clad layers(402a,402b) are formed on both sides of a substrate. A plurality of core layers(403a,403b) are patterned on each side of the clad layers. A plurality of over-clad layers(404a,404b) are formed on each side of the core layers. A plurality of metal layers are formed on each side of the over-clad layers. A waveguide is formed by laminating the clad layers, the patterned core layers, and the over-clad layers on the substrate. The clad layers, the patterned core layers, the over-clad layers are repeatedly formed on the waveguide.
申请公布号 KR20040081838(A) 申请公布日期 2004.09.23
申请号 KR20030016387 申请日期 2003.03.17
申请人 LG ELECTRONICS INC. 发明人 LEE, GI DONG;LEE, JAE EUN;LEE, SEONG EUN;YOON, SANG SU
分类号 G02B6/12;(IPC1-7):G02B6/12 主分类号 G02B6/12
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