CHIP SCALE PACKAGE AND FABRICATING METHOD THEREOF TO PROTECT ALL REGIONS OF SURFACE ACOUSTIC WAVE FILTER EXCEPT FOR PAD REGION

摘要

PURPOSE: A chip scale package and a fabricating method thereof are provided to protect all regions of a SAW(Surface Acoustic Wave) filter except for a pad region by using a wafer to wafer method. CONSTITUTION: A recess process is performed to recess a predetermined position of a bonding wafer corresponding to an operating region of a wafer including a SAW filter(S300). An opening process is performed to open a predetermined region of the bonding wafer corresponding to a pad region of the wafer including the SAW filter(S302). The bonding wafer is mounted on the wafer including the SAW filter(S304). A conductive material is inserted into the open region of the bonding wafer(S306).