| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate capable of efficiently manufacturing a substrate having high reliability at low cost.SOLUTION: An engraving portion 55 which irradiates the surface of a solder resist that is a resin insulating layer on the outermost layer with laser and has a font 56 including a plurality of elements 57 is formed on a wiring board. The step of forming the engraving portion 55 includes the steps of forming one element 57 with a plurality of projections 58 which are equally spaced from each other and are parallel to each other, and a step of forming another element 57 with the plurality of projections 58 which are equally spaced from each other and are parallel to each other so that the element 57 does not overlap the plurality of projections 58, by irradiation with laser. |
