发明名称 METHOD OF PRODUCING HIGHLY STRAINED PECVD SILICON NITRIDE THIN FILMS AT LOW TEMPERATURE
摘要 A method for increasing the level of stress for amorphous thin film stressors by means of modifying the internal structure of such stressors is provided. The method includes first forming a first portion of an amorphous film stressor material on at least a surface of a substrate, said first portion having a first state of mechanical strain defining a first stress value. After the forming step, the first portion of the amorphous film stressor material is densified such that the first state of mechanical strain is not substantially altered, while increasing the first stress value. In some embodiments, the steps of forming and densifying are repeated any number of times to obtain a preselected and desired thickness for the stressor.
申请公布号 US2006223290(A1) 申请公布日期 2006.10.05
申请号 US20050907454 申请日期 2005.04.01
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BELYANSKY MICHAEL P.;GLUSCHENKOV OLEG;LI YING;MALLIKARJUNAN ANUPAMA
分类号 H01L21/265;H01L21/31 主分类号 H01L21/265
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