| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacturing method for a multi-layer print comprising an embedded type conductive element. SOLUTION: This invention provides a manufacturing method for a multi-layer printed circuit board comprising the embedded type conductive element which is formed as a part of manufacturing of a printed circuit board layer. Then an insulating layer and a conductive layer are pressed onto the conductive element so that the conductive element protrudes from the surface of the conductive layer. By applying a processing process, these protruded part are removed to remove the embedded conductive element. By applying a conductive undercoat on the surface of the conductive layer, a second circuit pattern is formed on the conductive undercoat. COPYRIGHT: (C)2007,JPO&INPIT |
