| 摘要 |
A device for reducing the chance that a microelectromechanical systems (MEMS) device with moving parts will have those parts stick to a glass cover of the MEMS device, and a method for making the device. An example embodiment of the invention includes a MEMS device wafer, a substrate wafer, and a glass cover. The MEMS device wafer includes perforations corresponding to the location(s) of exposed glass on the cover. An example embodiment of a method of the invention includes applying metal layers to a glass cover, perforating a device wafer at locations corresponding to areas of exposed glass on the glass cover, mounting the device wafer to the substrate wafer, and anodically bonding the glass cover to the substrate wafer or to the device wafer.
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