发明名称 METHOD AND DEVICE FOR REMOVING INTEGRATED CIRCUITS
摘要 The present disclosure provides a method and device for removing an integrated circuit. The device is used to remove the integrated circuit from a display panel. The device includes a heating unit configured to contact and heat the display panel, and a retractable clamping-taking component configured to clamp and take the integrated circuit on the display panel which has been heated. According to embodiments of the present disclosure, the method and device may remove the integrated circuit from the display panel without destroying the display panel and increase efficiency of removing the integrated circuit.
申请公布号 US2016198599(A1) 申请公布日期 2016.07.07
申请号 US201514742820 申请日期 2015.06.18
申请人 BOE TECHNOLOGY GROUP CO., LTD. ;HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 SUN Yong;TANG Xianzhen;QIAN Zhiyu;YAN Long;ZHANG Jun;ZHU Daocheng;WANG Wei
分类号 H05K13/04;B32B38/10 主分类号 H05K13/04
代理机构 代理人
主权项 1. A device for removing an integrated circuit, configured to remove the integrated circuit from a display panel, the device comprising: a heating unit, configured to contact and heat the display panel; and a retractable clamping-taking component, configured to clamp and take the integrated circuit on the display panel which is heated.
地址 Beijing CN
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