| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat pump device capable of improving an operation efficiency (COP) by heating an object to be heated under an efficient utilization of calorie of refrigerant in a vapor compression circuit.SOLUTION: The heat pump device comprises: a vapor compression circuit R; a secondary medium circuit M2; a tertiary medium circuit M3 including a heat exchanger 82 for heating operation; a secondary medium heater 29; a tertiary medium heater 61; a Peltier element 92; a Peltier element heat exchanger 63 including an endotherm heat exchanging part for exchanging heat between the endotherm side of the Peltier element and the secondary medium in the secondary medium circuit, and a heat radiation side heat exchanging part for exchanging heat between the heat radiation side of the Peltier element and the tertiary medium in the tertiary medium circuit; and a three-way valve 74 for changing over the destination of a flow of the tertiary medium between the tertiary medium heater and the heat radiation side heat exchanging part of the Peltier element heat exchanger.SELECTED DRAWING: Figure 3 |
