COVERING MATERIAL FOR ADHESIVE HOT-MELT GLUES

摘要

The invention relates to a non-adhesive film-forming polymer composition (covering material) and to adhesive hot-melt glues in the form of pellets, which are covered with said polymer composition and can be produced by coextruding the hot-melt glue and the covering material. The film-forming composition comprises 5 to 40 wt% of at least one Fischer-Tropsch wax having a melting point of > 95 °C and 30 to 70 wt% of at least one metallocene-catalyzed polyolefin having a softening point of > 95 °C and a melt flow index (MFI) (230 °C, 2.16 kg) of ≤ 1000 and ≥ 300 g/10 minutes. The invention further relates to suitable uses for such hot-melt glues, to methods for using said hot-melt glues, and to products that contain said glues.