| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor package capable of achieving high bonding reliability while inhibiting adhesion of a sealing resin to a tool which conveys heat and pressure to the semiconductor chip.SOLUTION: In a manufacturing method of a semiconductor package where a tool for conveying heat and pressure to a semiconductor chip having a protrusion-like electrode and a thickness of 150 μm or less is brought into contact with the semiconductor chip, and the semiconductor chip is bonded to a counter substrate via a sealing resin, the area of contact surface between the tool and the semiconductor chip is smaller than the area of the semiconductor chip, and the shortest distance (d) between the edge of the contact surface and the edge of the semiconductor chip is 0-200 μm. |
