| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate and a substrate for a flexible printed wiring board having little temperature dependence of electric characteristics and excellent transmission characteristics.SOLUTION: The substrate in one embodiment of the present invention comprises a matrix and a reinforcing material included in the matrix, in which the matrix essentially comprises a fluorocarbon resin; and the substrate has, at -40°C or higher and 125°C or lower and at 10 GHz, a relative permittivity of 2.6 or less, a dielectric loss tangent of 0.004 or less, a variation width of the relative permittivity of 0.0001 or more and 0.08 or less, and a variation width of the dielectric loss tangent of 0.00001 or more and 0.002 or less. The substrate for a flexible printed wiring board in one embodiment of the present invention includes the above substrate and a conductive layer laminated on one surface side of the substrate. The reinforcing material is preferably glass cloth or resin cloth, and is preferably laminated in the middle in a thickness direction.SELECTED DRAWING: Figure 1 |
