| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order. |
| 申请公布号 |
US2016381796(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201615096993 |
申请日期 |
2016.04.12 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Sung-Uk;SEO Il-Jong;CHOI Jae-Hoon;BAEK Yong-Ho |
| 分类号 |
H05K1/11;H05K3/06 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
an insulating layer; a circuit layer embedded in the insulating layer; a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer; and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, wherein the metal post comprises a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order. |
| 地址 |
Suwon-si KR |
