SEALING MATERIAL, FLUX FOR SOLDERING, SOLDER PASTE, ELECTRONIC PART DEVICE, ELECTRONIC CIRCUIT MODULE AND ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing material capable of coping with densification of mounting, miniaturization of parts, pitch-reduction of the interval of arranged parts, or the like with sufficient adhesive strength, and capable of improving thermal reliability of connection between parts; and to provide a flux for soldering and a solder paste.

SOLUTION: The sealing material comprises an adhesive resin, a curing agent and at least one kind of an inorganic powder and an organic powder. The electronic parts, semiconductor chips or an electronic circuit module is connected to a chip-carrying board or a mother board by using the sealing material. The flux for soldering and the solder paste are also provided.

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