| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board with a semiconductor component that does not produce defects such as cracks easily at the time of flip-chip bonding. <P>SOLUTION: A semiconductor component 100 is connected with a pad array 40 on the side of a substrate through an individual solder joint 11 by a pad array 41 on the side of the component. In solder resist layers 108 and 8 on the side of the semiconductor and the substrate respectively, D/D0 is adjusted to be no less than 0.70 and no more than 0.99, where D is the footprint inner diameter of an aperture 8h on the side of the substrate and D0 is the footprint inner diameter of an aperture 108h on the side of the component. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
