| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip separation apparatus wherein steps between cracking of half-cut semiconductor wafers and separation thereof are integrated and automated thoroughly, so as to quickly and efficiently conduct serial works for separating individual chips from the semiconductor wafer. SOLUTION: The semiconductor chip separation apparatus 21 is used to separate individual semiconductor chips from a semiconductor wafer, and it is provided with a brake 25 to press the semiconductor wafer with a pressing roller 37, a backside scrubber 26 to scrub the semiconductor wafer that passes through the brake 25 while pressing it with a tip of a pin member 52, and a wafer conveyance 27 to automatically convey the semiconductor wafer to the backside scrubber 26 from the brake 25. COPYRIGHT: (C)2007,JPO&INPIT |
