发明名称 HOUSING STRUCTURE OF ELECTRONIC APPARATUS AND POWER CONDITIONER
摘要 PROBLEM TO BE SOLVED: To provide a housing structure of an electronic apparatus in which heat radiation is insusceptible to disturbance and heat is not transmitted from a radiator to an outer shell, and to provide a power conditioner.SOLUTION: A housing structure of an electronic apparatus includes: a radiator 1 having heat radiation fins, the radiator 1 where heating components 3a, 3b which generate heat through energization are mounted and the heat generated by the heating components 3a, 3b is conducted to the heat radiation fins to be radiated from the heat radiation fins; an outer shell 2 which houses the radiator 1 and the heating components 3a, 3b; and an upper surface plate 4 and a lower surface plate 6 serving as fixing members which fix the radiator 1 to the interior of the outer shell in a state that the radiator 1 does not directly contact with the outer shell. A wall of the outer shell has a double structure where an inner wall 2b faces an outer wall 2a forming a space therebetween.
申请公布号 JP2014146769(A) 申请公布日期 2014.08.14
申请号 JP20130016030 申请日期 2013.01.30
申请人 MITSUBISHI ELECTRIC CORP 发明人 NISHIO KENJI
分类号 H05K7/20 主分类号 H05K7/20
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