| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor device capable of improving reliability of a sealing performance by preventing a problem of airtightness failure or lead corrosion, concerning the semiconductor pressure sensor having a structure wherein a sensor module storing a semiconductor pressure sensor part is molded integrally in an exterior case. SOLUTION: This device is constituted of the semiconductor pressure sensor part for converting a pressure into an electric signal, the sensor module formed by insert-molding the semiconductor pressure sensor part and a terminal a part of which is drawn out to the outside by the first resin, and the exterior case stored in the sensor module, wherein a connector part is formed by insert-molding the sensor module furthermore by the second resin. The device has a characteristic wherein the boundary between an exposure part from the second resin of the sensor module and the second resin is covered with an adhesive. COPYRIGHT: (C)2007,JPO&INPIT |
