发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve the cleaning property of a resin molding die. <P>SOLUTION: A sheet 1 for mask, a sheet 17 for cleaning, and cylindrical rubber-like resin 12 for cleaning are arranged on a lower die 4 of the molding die 2. Thereafter, the molding die 2 is clamped to pour the resin for cleaning into a cavity, and to effect the cleaning of the molding die 2 whereby the resin for cleaning can be poured into places where the resin is hardly sneaked by only the pouring pressure from a pod 9. According to this method, the molding die 2 can be cleaned without receiving the affection of variety in pouring pressures of resin for transfer mold whereby the cleaning property of the molding die 2 can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007242924(A) 申请公布日期 2007.09.20
申请号 JP20060063954 申请日期 2006.03.09
申请人 RENESAS TECHNOLOGY CORP 发明人 TSUCHIDA KIYOSHI
分类号 H01L21/56;B29C33/72 主分类号 H01L21/56
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