| 摘要 |
PROBLEM TO BE SOLVED: To provide a seismic damage spread reduction method and a seismic damage spread reduction system in a semiconductor manufacturing device capable of predicting the occurrence of an earthquake and preventing the collapse of a boat, and suppressing damage to a minimum. SOLUTION: There are provided a receiving section 28 for receiving emergency earthquake information based on initial micromotion delivered via a communication line 26 or an initial micromotion detector for directly detecting the initial micromotion, and a control section 29 for executing a first step of stopping an operation of a semiconductor manufacturing device 1 based on received emergency earthquake information or detected initial micromotion and a second step of holding a boat 4 in a contact state or in a non-contact state, to prevent the collapse of the boat 4 in which processing objects are mounted in multiple stages. COPYRIGHT: (C)2008,JPO&INPIT
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