发明名称 |
ELEMENT SUBSTRATE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide an element substrate wherein a metal layer is formed with sufficient accuracy, and to provide its manufacturing method. SOLUTION: The method includes: a step of forming a release layer on a first supporting substrate; a step of forming a metal layer 33 of a predetermined pattern on the release layer; a process for arranging a second supporting substrate 110 above the first supporting substrate 10 while putting the metal layer in-between; a step of pouring in a resin material 114a in a state of fluidity between the first supporting substrate and the second supporting substrate; a step of curing the resin material and for forming a resin substrate 114; a step of transferring the metal layer to the resin substrate while releasing the metal layer from the first supporting substrate by decomposing the exfoliation layer; and a step of polishing the backside of the resin substrate. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008098563(A) |
申请公布日期 |
2008.04.24 |
申请号 |
JP20060281356 |
申请日期 |
2006.10.16 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KANEDA TOSHIHIKO;KIMURA SATOSHI;FURUHATA HIDEMICHI;KIJIMA TAKESHI |
分类号 |
H05K3/20;H01B5/14;H01B13/00 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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