| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion module which has less components and has a simple structure and can achieve impedance matching as a whole including a semiconductor optical element and an external circuit board. SOLUTION: The photoelectric conversion module 1 is equipped with a lead frame 2 having a photoelectric conversion element 10, a signal lead 12 which is mounted with the photoelectric conversion element 10 and propagates an electric signal to or from the photoelectric conversion element 10, and a grounding lead 13, and includes a mold resin for molding at least a portion 11 of the lead frame 2 whereon the photoelectric conversion element 10 is mounted, the signal lead 12, and the photoelectric conversion element 10 while exposing the grounding lead 13. The signal lead 12 is separated from the element mounting portion 11 of the lead frame 2, and the grounding lead 13 is extended from the element mounting portion 11 of the lead frame 2 and in close contact with at least one face of the mold resin and is so folded back as to face the signal lead 12. COPYRIGHT: (C)2008,JPO&INPIT
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