| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress attenuation of a high-frequency signal in a semiconductor device such as a CSP having rewiring to transmit the high-frequency signal. <P>SOLUTION: A dummy pad portion 2 is provided in the middle of the rewiring 24 for transmitting the high-frequency signal, on which a dummy post 28 is provided. Ground wiring 29, 30 are provided at both sides of a width direction of the rewiring 24, and the attenuation of the high-frequency signal is suppressed due to existence of the dummy pad portion 2 and the dummy post 28. <P>COPYRIGHT: (C)2008,JPO&INPIT |
