发明名称 METHOD FOR MANUFACTURING LED DEVICE
摘要 <p>A structure of an LED device and a manufacturing method for the same are disclosed, capable of enabling currents supplied from electrodes to be uniformly diffused throughout an LED part and thereby improving the light emission efficiency, by forming the LED device into at least a hexagonal column to a circular column, rather than a conventional triangular or square column. The method according to an embodiment of the present invention includes (a) forming an LED structure including an n-type LED layer, an active layer, and a p-type LED on a substrate; (b) forming a plurality of structure supporting layers in the form of a cylinder or at least a hexagonal column on the LED structure formed in the step (a); (c) separating the LED structure formed in the step (a) by dry etching or wet etching using the plurality of structure supporting layers formed in the step (b) as guides, into a plurality of LED devices having a cylinder shape or at least hexagonal column shape; and (d) removing the substrate and forming an electrode part on a surface of each LED device, being exposed by removal of the substrate.</p>
申请公布号 WO2009028895(A2) 申请公布日期 2009.03.05
申请号 WO2008KR05071 申请日期 2008.08.29
申请人 WAVESQUARE INC.;KO, HYUN CHUL;CHO, MEOUNG WHAN;JANG, PIL GUK;CHO, BYUNG IL 发明人 KO, HYUN CHUL;CHO, MEOUNG WHAN;JANG, PIL GUK;CHO, BYUNG IL
分类号 H01L33/00;H01L33/20 主分类号 H01L33/00
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