| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, and a substrate processing apparatus, excellent in particle reducing effectiveness and improving productivity. SOLUTION: The method of manufacturing the semiconductor device includes a manufacturing step to load a wafer 10 into a reactor 1, a manufacturing step to form a membrane on the wafer 10 inside the reactor 1, a manufacturing step to unload the wafer 10 from the reactor 1 after the membrane is formed on the wafer 10, and a manufacturing step of, after the wafer 10 is unloaded, forcibly cooling an interior of the reactor 1 without the wafer 10 inside the reactor 1, by using forcibly cooling mechanism 40 arranged covering the reactor 1 outside the reactor 1. COPYRIGHT: (C)2009,JPO&INPIT |
