| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
A semiconductor package includes a package substrate; a semiconductor chip mounted on a top surface of the package substrate; a chip pad disposed on a bottom surface of the semiconductor chip to face the top surface of the package substrate, the chip pad including a connection pad and a measurement pad; and a chip bump including a first bump provided between the package substrate and the connection pad and a second bump provided between the package substrate and the measurement pad. An interconnection disposed within the package substrate is not connected to the second bump to be electrically isolated from the second bump. |
| 申请公布号 |
US2016163608(A1) |
申请公布日期 |
2016.06.09 |
| 申请号 |
US201514751626 |
申请日期 |
2015.06.26 |
| 申请人 |
Samsung Electronics Co.,Ltd. |
发明人 |
Park Jin-Woo;Kim Ji Hwang;Shim Jongbo |
| 分类号 |
H01L21/66;H01L23/498;H01L23/31 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a package substrate; a semiconductor chip on a top surface of the package substrate; a chip pad on a bottom surface of the semiconductor chip to face the top surface of the package substrate, the chip pad including a connection pad and a measurement pad; and a chip bump including a first bump between the package substrate and the connection pad and a second bump between the package substrate and the measurement pad, wherein an interconnection within the package substrate is not connected to the second bump to be electrically isolated from the second bump. |
| 地址 |
Suwon-si KR |
